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23 ms6m 00765 h04-004-03a a 3 japan o 7MBP25TEA120 25a 1200v lot no. 1. ?? 2. ???????? 3. ???? " " means theoretical dimensions. the dimensions of the terminals are defined at the bottom. the dimensions in ( ) means referential values. indication of lot no. odered no. in monthly manufactured month last digit of manufactured year (jan. sep.:1 9,oct.:o,nov.:n,dec.:d) dimensions in mm package type : p622 ? ) notes 1. package outline drawings a
23 ms6m 00765 h04-004-03a a 4 2 pin descriptions ?x main circuit description positive input supply voltage. output (u). output (v). output (w). negative input supply voltage. collector terminal of brake igbt. control circuit symbol description gndu high side ground (u). almu alarm signal output (u). vinu logic input for igbt gate drive (u). vccu high side supply voltage (u). gndv high side ground (v). almv alarm signal output (v). vinv logic input for igbt gate drive (v). vccv high side supply voltage (v). gndw high side ground (w). almw alarm signal output (w). ? vinw logic input for igbt gate drive (w). ? vccw high side supply voltage (w). ? gnd low side ground. ? vcc low side supply voltage. ? vindb logic input for brake igbt gate drive. ? vinx logic input for igbt gate drive (x). ? viny logic input for igbt gate drive (y). ? vinz logic input for igbt gate drive (z). ? alm low side alarm signal output. b w n symbol p u v
23 ms6m 00765 h04-004-03a a 5 3. block diagram pre-drivers include following functions 1.amplifier for driver 2.short circuit protection 3.under voltage lockout circuit 4.over current protection 5.igbt chip over heating protection u v w vcc vinx gnd viny vinz alm b n vindb vccw almw gndw vccv almv gndv p vccu almu gndu vinu vinv vinw pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver vz r alm 1.5k r alm 1.5k vz r alm 1.5k vz vz vz vz vz r alm 1.5k pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver 4 3 2 1 8 6 5 7 12 11 10 9 14 16 13 17 18 15 19 u v w vcc vinx gnd viny vinz alm b n vindb vccw almw gndw vccv almv gndv p vccu almu gndu vinu vinv vinw pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver vz r alm 1.5k r alm 1.5k vz r alm 1.5k vz vz vz vz vz r alm 1.5k pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver pre- driver 4 4 3 2 1 8 6 5 7 12 11 10 9 14 16 13 17 18 15 19
23 ms6m 00765 h04-004-03a a 6 4. absolute maximum ratings ~?? tc 25 unless otherwise specified. symbol min. max. units bus voltage dc v dc 0 900 v (between terminal p and n) surge v dc(surge) 0 1000 v short operating vsc 400 800 v collector-emitter voltage *1 vces 0 1200 v dc ic - 25 a collector current 1ms icp - 50 a duty= 100% *2 -ic - 25 a collector power dissipation one transistor *3 pc - 139 w dc ic - 15 a 1ms icp - 30 a forward current diode i f -15a collector power dissipation one transistor *3 pc - 139 w supply voltage of pre-driver *4 vcc -0.5 20 v input signal voltage *5 vin -0.5 vcc+0.5 v input signal current iin - 3 ma alarm signal voltage *6 valm -0.5 vcc v alarm signal current *7 alm - 20 ma junction temperature tj - 150 operating case temperature topr -20 100 storage temperature tstg -40 125 solder temperature *8 tsol - 260 isolating voltage (terminal to base, 50/60hz sine wave 1min.) screw torque mounting (m5) - - 3.5 nm note *1 vces shall be applied to the input voltage between terminal p and u or or w or db, n and u or v or w or db. *2 125 /fwd rth(j-c)/(icvf max)=125/2.05/(252.0)100>100% *3 pc=125 /igbt rth(j-c)=125/0.59= 139w [inverter] pc=125 /igbt rth(j-c)=125/0.59= 139w [brake] *4 vcc shall be applied to the input voltage between terminal no.4 and 1, 8 and 5, 12 and 9, 14 and 13 *5 v shall be applied to the input voltage between terminal no.3 and 1, 7 and 5, 11 and 9, 16,17,18 and 13. *6 shall be applied to the voltage between terminal no.2 and 1, no6 and 5, no10 and 9, no.19 and 13 *7 shall be applied to the input current to terminal no.2,6,10 and 19 *8 immersion time 101sec. vrms items viso - ac2500 collector current inverter brake
23 ms6m 00765 h04-004-03a a 7 5. electrical characteristics tj 25 vcc 15v unless otherwise specified. 5.1 main circuit symbol min. typ. max. units collector current 1200v at off signal input vin terminal open. collector-emitter ? 25a terminal - - 3.1 saturation voltage chip - 2.4 - v - =25a terminal - - 2.0 chip - 1.6 - v collector current 1200v at off signal input vin terminal open. collector-emitter terminal - - 2.6 saturation voltage chip - 1.9 - v terminal - - 3.3 chip - 1.9 - v turn-on time ton v dc 600v tj=125 1.2 - - turn-off time toff ic 25a fig.1 fig.6 - - 3.6 s v dc 600v if 25a fig.1 fig.6 5.2 control circuit symbol min. typ. max. units supply current switching frequency supply current tc -20 100 fig.7 on 1.00 1.35 1.70 off 1.25 1.60 1.95 input zener voltage vz rin 20k ? -8.0- v fig.2 tc -20 1.1 - - alarm signal hold time talm tc 25 -2.0-ms tc 125 --4.0 resistor for current limit ralm 1425 1500 1575 vf i ces : 0 15khz v ce ?1 5 a - ? 15a 0.3 - - trr item conditions item conditions reverse recovery time forward voltage of fwd i ces v ce vf forward voltage of diode v ma ma --15 --45 vin(th) input signal threshold voltage of n-side pre-driver of p-side pre-driver (one unit) iccp iccn ma --1.0ma --1.0 inverter brake
23 ms6m 00765 h04-004-03a a 8 5.3 protection section (vcc=15v) symbol conditions min. typ. max. units over current protection level of inverter circuit over current protection level of brake circuit over current protection delay time tdoc tj=125 -5- s sc protection delay time tsc tj=125 fig.4 - - 8 s igbt chips over heating tjoh surface protection temperature level of igbt chips over heating protection hysteresis tjh - 20 - under voltage protection level vuv 11.0 - 12.5 under voltage protection hysteresis vh 0.2 0.5 - 6. thermal characteristics (tc=25 ) symbol min. typ. max. units junction to case inverter igbt rth(j-c) - - 0.90 thermal resistance *9 fwd rth(j-c) - - 2.05 /w brake igbt rth(j-c) - - 0.90 case to fin thermal resistance with compound rth(c-f) - 0.05 - *9 ( for 1device case is under the device ) 7. noise immunity (vdc=300v, vcc=15v, test circuit fig 5. item min. typ. max. units common mode pulse width 1 s,polarity ,10 minuets 2.0 - - kv rectangular noise judge no over-current, no miss operating common mode rise time 1.2us,fall time 50 s interval 20s ,10 tim es 5.0 - - kv lightning surge judge no over-current, no miss operating 8. recommended operating conditions symbol min. typ. max. units dc bus voltage vdc - - 800 v power supply voltage of pre-driver vcc 13.5 15.0 16.5 v screw torque (m5) - 2.5 - 3.0 nm 9. weight symbol min. typ. max. units weight wt - 270 - g item item item ioc item conditions tj=125 tj=125 38 23 --a a -- 150 - - v
23 ms6m 00765 h04-004-03a a 9 ?h ?h f f 1 /vin vge (inside ipm) fault (inside ipm) /alm gate off on gate on 2ms(typ.) off normal t alm t alm max. t alm max. off fault over-current,over-heat or under-voltage on ?? alarm figure 1. switching time waveform definitions figure 2. input/output timing diagram figure 3. over-current protection timing diagram on /vin ic /alm tdoc ioc off alarm on tdoc necessary conditions for alarm reset (refer to 1 to 3 in figure2.) 1 this represents the case when a failure-causing fault lasts for a period more than talm. the alarm resets when the input vin is off and the fault has disappeared. 2 this represents the case when the on condition of the input vin lasts for a period more than talm. the alarm resets when the vin turns off under no fault conditions. 3 this represents the case when the fault disappears and the vin turns off within talm. the alarm resets after lasting for a period of the specified time talm. when a collector current over the oc level flows and the off command is input within a period less than the trip delay time tdoc, the current is hard-interrupted and no alarm is output. when a collector current over the oc level flows for a period more than the trip delay time tdoc, the current is soft-interrupted. if this is detected at the lower arm igbts, an alarm is output. period 1 : period 2 :
23 ms6m 00765 h04-004-03a a 10 ic ic ic i alm i alm i alm t sc figure.4 definition of tsc figure 5. noise test circuit figure 6. switching characteristics test circuit figure 7. icc test circuit ipm p u v w n ct ac400v noise 4700p cooling fin vccu vinu gndu vcc vinx gnd 20k 20k dc 1 5v dc 1 5v sw 1 sw2 earth ipm p vcc vin gnd 20k dc 1 5v hcpl- 4504 dc600v n l ic ipm p u v w n vcc vin gnd dc 1 5v p.g +8v fsw icc
23 ms6m 00765 h04-004-03a a 11 input output (vin) (igbt) low on high off u-phase v-phase w-phase low side alm-u alm-v alm-w alm oc off * * * l h h h uv off * * * l h h h tjoh off * * * l h h h oc * off * * h l h h uv * off * * h l h h tjoh * off * * h l h h oc * * off * h h l h uv * * off * h h l h tjoh * * off * h h l h oc * * * off h h h l uv * * * off h h h l tjoh * * * off h h h l igbt alarm output fault high side u-phase high side v-phase high side w-phase low side 10. truth table 10.1 igbt control the following table shows the igbt on/off status with respect to the input signal vin. the igbt turn-on when vin is at ?low? level under no alarm condition. 10.2 fault detection (1) when a fault is detected at the high side, only the detected arm stops its output. at that time the ipm dosen?t any alarm. (2) when a fault is detected at the low side, all the lower arms stop their outputs and the ipm outputs an alarm of the low side. * depend on input logic.
23 ms6m 00765 h04-004-03a a 12 11. cautions for design and application O??m?? 1. trace routing layout should be designed with particular attention to least stray capacity between the primary and secondary sides of optical isolators by minimizing the wiring length between the optical isolators and the ipm input terminals as possible. ????g?O??????????[ ?`??? 2. mount a capacitor between vcc and gnd of each high-speed optical isolator as close to as possible. ???? vcc-gnd g??????? 3. for the high-speed optical isolator, use high-cmr type one with tphl, tplh Q 0.8s. ????? tphl,tplh Q 0.8us cmr ??? 4. for the alarm output circuit, use low-speed type optical isolators with ctr R 100%. `????? ctr R 100% ??? 5. for the control power vcc, use four power supplies isolated each. and they should be designed to reduce the voltage variations. ? vcc ?~F???????R??O?? 6. suppress surge voltages as possible by reducing the inductance between the dc bus p and n, and connecting some capacitors between the p and n terminals. p-n g?????? p-n g?????A???` ?R?p 7. to prevent noise intrusion from the ac lines, connect a capacitor of some 4700pf between the three-phase lines each and the ground. ac ???`g??????A 8. at the external circuit, never connect the control terminal gndu to the main terminal u-phase, gndv to v-phase, gndw to w-phase, and gnd to n-phase. otherwise, malfunctions may be caused. ???? v ?? w ? ? n ???A?`???? 9. take note that an optical isolator?s response to the primary input signal becomes slow if a capacitor is connected between the input terminal and gnd. -gnd g?????A?????????rgL?? ??? 10. taking the used isolator?s ctr into account, design with a sufficient allowance to decide the primary forward current of the optical isolator. ?????????? ctr ??]????O??
23 ms6m 00765 h04-004-03a a 13 11. in case of mounting this product on cooling fin, use thermal compound to secure thermal conductivity. if the thermal compound amount was not enough or its applying method was not suitable, its spreading will not be enough, then, thermal conductivity will be worse and thermal run away destruction may occur. confirm spreading state of the thermal compound when its applying to this product. (spreading state of the thermal compound can be confirmed by removing this product after mounting.) ?????H???_?????? ?T??Tm??????????o ????????TH?? u????????_J? ( g???????????_J? ) 12. use this product with keeping the cooling fin's flatness between screw holes within 100um at 100mm and the roughness within 10um. also keep the tightening torque within the limits of this specification. too large convex of cooling fin may cause isolation breakdown and this may lead to a critical accident. on the other hand, too large concave of cooling fin makes gap between this product and the fin bigger, then, thermal conductivity will be worse and over heat destruction may occur. ??????g??? 100mm 1 00um ??1 0um ? ^?????u?~F? ???1??k??? ?^????u? ??g??????? ????? 13. this product is designed on the assumption that it applies to an inverter use. sufficient examination is required when applying to a converter use. please contact fuji electric co.,ltd if you would like to applying to converter use. u??`??m??O???`?m??? ???????`m??Bj 14. please see the fuji igbt-ipm r series application manual and fuji igbt modules n-series application manual . ? igbt-ipm r ` ??`???? igbt ?????? n ` ??`??? ? 15. there is thermal interference between nearby power devices, because the econo ipm is a compact package. therefore you measure the case temperature just under the igbt chips that showed in report mt6m04545, and estimate the chip temperature. econo ipm ???`???`??h? ????? mt6m04545 ???R`??y? heat sink mounting holes +100 m 0
23 ms6m 00765 h04-004-03a a 14 (a)in case of use of high side alarm ?`?`??? (b)in case of no use of high side alarm ?`?`???? vccu gndu + 0. 1 uf 20k 1 0u f +5v hcpl4504 vccv gndv + 0. 1 uf 20k 1 0u f vccw gndw ? ? + 0. 1 uf 20k 1 0u f vcc gnd ? ? ? + 0. 1 uf 20k 1 0u f ? 0. 1 uf 20k ? 0. 1 uf 20k ? 0. 1 uf 20k ? ?h? u igbt ?? ?h? v igbt ?? ?h? w igbt ?? ?h? x igbt ?? ?h? y igbt ?? ?h? z igbt ?? ?h? db_igbt ?? c+ u v w b n p r a c 2 0 0 v ipm ipm ipm ipm tlp52 1 vccu gndu + 0. 1 uf 20k 1 0u f +5v hcpl4504 vccv gndv + 0. 1 uf 20k 1 0u f vccw gndw ? ? + 0. 1 uf 20k 1 0u f vcc gnd ? ? ? + 0. 1 uf 20k 1 0u f ? 0. 1 uf 20k ? 0. 1 uf 20k ? 0. 1 uf 20k ? ?h? u igbt ?? ?h? v igbt ?? ?h? w igbt ?? ?h? x igbt ?? ?h? y igbt ?? ?h? z igbt ?? ?h? db_igbt ?? c+ u v w b n p r a c 2 0 0 v ipm ipm ipm ipm tlp52 1 vccu gndu + 0. 1 uf 20k 1 0u f +5v hcpl4504 vccv gndv + 0. 1 uf 20k 1 0u f vccw gndw ? ? + 0. 1 uf 20k 1 0u f vcc gnd ? ? ? + 0. 1 uf 20k 1 0u f ? 0. 1 uf 20k ? 0. 1 uf 20k ? 0. 1 uf 20k ? ?h? u igbt ?? ?h? v igbt ?? ?h? w igbt ?? ?h? x igbt ?? ?h? y igbt ?? ?h? z igbt ?? ?h? db_igbt ?? c+ u v w b n p r a c 2 0 0 v ipm ipm ipm ipm tlp52 1 vccu gndu + + 0. 1 uf 20k 1 0u f +5v hcpl4504 vccv gndv + + 0. 1 uf 20k 1 0u f vccw gndw ? ? + + 0. 1 uf 20k 1 0u f vcc gnd ? ? ? + + 0. 1 uf 20k 1 0u f ? 0. 1 uf 20k ? 0. 1 uf 20k ? 0. 1 uf 20k ? ?h? u igbt ?? ?h? v igbt ?? ?h? w igbt ?? ?h? x igbt ?? ?h? y igbt ?? ?h? z igbt ?? ?h? db_igbt ?? c+ u v w b n p r a c 2 0 0 v ipm ipm ipm ipm tlp52 1 vccu gndu + 0. 1 uf 20k 1 0u f +5v hcpl4504 vccv gndv + 0. 1 uf 20k 1 0u f vccw gndw ? ? + 0. 1 uf 20k 1 0u f vcc gnd ? ? ? + 0. 1 uf 20k 1 0u f ? 0. 1 uf 20k ? 0. 1 uf 20k ? 0. 1 uf 20k ? ?h? u igbt ?? ?h? v igbt ?? ?h? w igbt ?? ?h? x igbt ?? ?h? y igbt ?? ?h? z igbt ?? ?h? db_igbt ?? c+ u v w b n p r a c 2 0 0 v ipm ipm ipm ipm tlp52 1 vccu gndu + + 0. 1 uf 20k 1 0u f +5v hcpl4504 vccv gndv + + 0. 1 uf 20k 1 0u f vccw gndw ? ? + + 0. 1 uf 20k 1 0u f vcc gnd ? ? ? + + 0. 1 uf 20k 1 0u f ? 0. 1 uf 20k ? 0. 1 uf 20k ? 0. 1 uf 20k ? ?h? u igbt ?? ?h? v igbt ?? ?h? w igbt ?? ?h? x igbt ?? ?h? y igbt ?? ?h? z igbt ?? ?h? db_igbt ?? c+ u v w b n p r a c 2 0 0 v ipm ipm ipm ipm tlp52 1 12. example of applied circuit ? 13. package and marking y? please see the mt6m4140 which is packing specification of ipm ipm y? ?? 14. cautions for storage and transportation ?\?? ? store the modules at the normal temperature and humidity (5 to 35c, 45 to 75%). 3? (5 35 45 75%) ?? ? avoid a sudden change in ambient temperature to prevent condensation on the module surfaces. ?`Y?????? ? avoid places where corrosive gas generates or much dust exists. ???k?m??? ? store the module terminals under unprocessed conditions ?`???B???? . ? avoid physical shock or falls during the transportation. \rn??? 15. scope of application m this specification is applied to the igbt-ipm (type: 7MBP25TEA120). ?? igbt-ipm ( ? 7MBP25TEA120) m?? 16. based safety standards ??? ul1557
23 ms6m 00765 h04-004-03a a 15 characteristics 17-1.control circuit characteristics(respresentative) 0 0.5 1 1.5 2 2.5 12 13 14 15 16 17 18 input signal threshold voltage vs. power supply voltage (typ.) input signal threshold voltage : vin(on),vin(off) (v) power supply voltage : vcc (v) tj=25c tj=125c } vin(on) } vin(off) 0 2 4 6 8 10 12 14 20 40 60 80 100 120 140 under voltage vs. junction temperature (typ.) under voltage : vuvt (v) junction temperature : tj (c) 0 0.2 0.4 0.6 0.8 1 20 40 60 80 100 120 140 under voltage hys terisis vs. jnc tion temperature (typ.) under voltage hysterisis : vh (v) junction temperature : tj (c) 0 0.5 1 1.5 2 2.5 3 12 13 14 15 16 17 18 alarm hold time vs. power supply voltage (typ.) alarm hold time : talm (msec) power supply voltage : vcc (v) tc=100c tc=25c 0 50 100 150 200 12 13 14 15 16 17 18 over heating characteristics tjoh,tjh vs. vcc (typ.) over heating protection : tjoh (c) oh hysterisis : tjh (c) power supply voltage : vcc (v) tjoh tjh 0 5 10 15 20 25 30 0 5 10 15 20 25 power supply current vs. switching frequency tj=125c (typ.) n-side p-side power supply current : icc (ma) switching frequency : fsw (khz) vcc=13v vcc=13v vcc=15v vcc=15v vcc=17v vcc=17v
23 ms6m 00765 h04-004-03a a 1 7-2.main circuit characteristics (representative) 16 0 10 20 30 40 50 00.511.522.533.54 collector current vs. collector-emitter voltage (typ.) tj=25c / chip vcc=13v vcc=15v vcc=17v collector current : ic (a) collector-emitter voltage : vce (v) 0 10 20 30 40 50 0 0.5 1 1.5 2 2.5 3 3.5 4 collector current vs. collector-emitter voltage (typ.) tj=25c / terminal vcc=13v vcc=15v vcc=17v collector current : ic (a) collector-emitter voltage : vce (v) 0 10 20 30 40 50 00.511.522.533.54 collector current vs. collector-emitter voltage (typ.) tj=125c / chip vcc=13v vcc=15v vcc=17v collector current : ic (a) collector-emitter voltage : vce (v) 0 10 20 30 40 50 0 0.5 1 1.5 2 2.5 3 3.5 4 collector current vs. collector-emitter voltage (typ.) tj=125c / terminal vcc=13v vcc=15v vcc=17v collector current : ic (a) collector-emitter voltage : vce (v) 0 10 20 30 40 50 0 0.5 1 1.5 2 2.5 forward current vs. forward voltage (typ.) chip 125c 25c forward current : if (a) forward voltage : vf (v) 0 10 20 30 40 50 0 0.5 1 1.5 2 2.5 forward current vs. forward voltage (typ.) terminal 125c 25c forward current : if (a) forward voltage : vf (v)
23 ms6m 00765 h04-004-03a a 17 0 5 10 15 0 1020304050 switching loss vs. collector current (typ.) edc=600v,vcc=15v,tj=25c eon eoff err switching loss : eon,eoff,err (mj/cycle) collector current : ic (a) 0 5 10 15 0 1020304050 switching loss vs. collector current (typ.) edc=600v,vcc=15v,tj=125c eon eoff err switching loss : eon,eoff,err (mj/cycle) collector current : ic (a) 0 50 100 150 200 250 300 350 0 200 400 600 800 1000 1200 1400 reversed biased safe operating area vcc=15v,tj Q 125 (min.) collector current : ic (a) collector-emitter voltage : vce (v) scsoa (non-repetitive pulse) rbsoa (repetitive pulse) 0 50 100 150 200 0 20 40 60 80 100 120 140 160 power derating for igbt (max.) (per device) collecter power dissipation : pc (w ) case temperature : tc (c) 0 20 40 60 80 100 0 20406080100120140160 power derating for fwd (max.) (per device) collecter power dissipation : pc (w ) case temperature : tc (c) 0.01 0.1 1 0.001 0.01 0.1 1 10 transient thermal resistance (max.) thermal resistance : rth(j-c) ( /w) pulse width :pw (sec) fwd igbt
23 ms6m 00765 h04-004-03a a 18 10 100 1000 10000 0 1020304050 switching time vs. collector current (typ.) edc=600v,vcc=15v,tj=25c switching time : ton,toff,tf (nsec) collector current : ic (a) toff ton tf 10 100 1000 10000 0 1020304050 switching time vs. collector current (typ.) edc=600v,vcc=15v,tj=125c switching time : ton,toff,tf (nsec) collector current : ic (a) toff ton tf 1 10 100 0 1020304050 reverse recovery characteristics trr,irr vs.if (typ.) reverse recovery current:irr(a) reverse recovery time:trr(nsec) forward current:if(a) trr125c trr25c irr125c irr25c
23 ms6m 00765 h04-004-03a a 19 1 7-3.dynamic brake characteristics (respresentative) 0 10 20 30 40 00.511.522.533.54 collector current vs. collector-emitter voltage (typ.) tj=25c vcc=13v vcc=15v vcc=17v collector current : ic (a) collector-emitter voltage : vce (v) 0 10 20 30 40 0 0.5 1 1.5 2 2.5 3 3.5 4 collector current vs. collector-emitter voltage (typ.) tj=125c vcc=13v vcc=15v vcc=17v collector current : ic (a) collector-emitter voltage : vce (v) 0.01 0.1 1 0.001 0.01 0.1 1 transient thermal resistance (max.) thermal resistance : rth(j-c) ( /w) pulse width :pw (sec) igbt 0 30 60 90 120 150 180 210 0 200 400 600 800 1000 1200 1400 reversed biased safe operating area vcc=15v,tj Q 125 (min.) collector current : ic (a) collector-emitter voltage : vce (v) scsoa (non-repetitive pulse) rbsoa (repetitive pulse) 0 50 100 150 200 0 20406080100120140160 power derating for igbt (max.) (per device) collecter power dissipation : pc (w ) case temperature : tc (c)
23 ms6m 00765 h04-004-03a a 20 test cate- gories test items test methods and conditions reference norms eiaj ed-4701 number of sample accept- ance number 1 terminal strength pull force : 20 n (main terminal) test method 401 5 ( 1 : 0 ) ? 10 n (control terminal) method (pull test) test time : 10 1 sec. 2 mounting strength screw torque : 2.5 ~ 3.5 n ? m (m5) test method 402 5 ( 1 : 0 ) test time : 10 1 sec. method 3 vibration range of frequency : 10 500 hz test method 403 5 ( 1 : 0 ) sweeping time : 15 min. condition code b acceleration : 100 m/s 2 sweeping direction : each x,y,z axis test time : 6 hr. (2hr./direction) 4 shock maximum acceleration : 5000 m/s 2 test method 404 5 ( 1 : 0 ) n pulse width 1.0 ms condition code b direction : each x,y,z axis test time : 3 times/direction 5 solderabitlity solder temp. : 235 5 test method 303 5 ( 1 : 0 ) ? immersion duration : 5.0 0.5 sec. condition code a test time : 1 time each terminal should be immersed in solder within 1~1.5mm from the body. 6 resistance to solder temp. : 260 5 test method 302 5 ( 1 : 0 ) soldering heat immersion time : 10 1sec. condition code a ?? test time : 1 time each terminal should be immersed in solder within 1~1.5mm from the body. 1 high temperature storage temp. : 125 5 test method 201 5 ( 1 : 0 ) storage test duration : 1000 hr. 2 low temperature storage temp. : -40 5 test method 202 5 ( 1 : 0 ) storage test duration : 1000 hr. 3 temperature storage temp. : 85 2 test method 103 5 ( 1 : 0 ) humidity storage relative humidity : 85 5% test code c ?? test duration : 1000hr. 4 unsaturated test temp. : 120 2 test method 103 5 ( 1 : 0 ) pressure cooker atmospheric pressure : 1.7x10 5 pa test code e ??`?` test humidity : 85 5% test duration : 96 hr. 5 temperature test temp. : minimum storage temp. -40 5 test method 105 5 ( 1 : 0 ) cycle maximum storage temp. 125 5 ?? normal temp. 5 ~ 35 dwell time : tmin ~ t n ~ tmax ~ t n 1hr. 0.5hr. 1hr. 0.5hr. number of cycles : 100 cycles 6 thermal shock +0 test method 307 5 ( 1 : 0 ) n test temp. : high temp. side 100 - 5 method +5 condition code a low temp. side 0 - 0 fluid used : pure water (running water) dipping time : 5 min. par each temp. transfer time : 10 sec. number of cycles : 10 cycles mechanical tests environment tests mechanical tests environment tests 18. reliability test items
23 ms6m 00765 h04-004-03a a 21 test cate- gories test items test methods and conditions reference norms eiaj ed-4701 number of sample acc ept- ance number 1 high temperature test temp. : ta = 125 5 test method 101 5 ( 1 : 0 ) reverse bias (tj Q 150 ) ????? bias voltage : vc = 0.8vces bias method : applied dc voltage to c-e vcc = 15v test duration : 1000 hr. 2 intermitted on time : 2 sec. test method 106 5 ( 1 : 0 ) operating life off time : 18 sec. (power cycle) test temp. : ? tj=100 5deg ?A tj Q 150 , ta=25 5 number of cycles : 15000 cycles e n d urance tests endurance tests item characteristic symbol failure criteria unit note lower limit upper limit electrical leakage current ices - usl2 ma characteristic saturation voltage vce(sat) - usl1.2 v forward voltage vf - usl1.2 v thermal igbt th(j-c) -usl1.2 /w resistance fwd th(j-c) -usl1.2 /w over current protection ioc lsl0.8 usl1.2 alarm signal hold time talm lsl0.8 usl1.2 ms isolation voltage viso broken insulation - visual visual inspection inspection peeling - the visual sample - plating and the others lsl : lower specified limit. usl : upper specified limit. note : each parameter measurement read-outs shall be made after stabilizing the components at room ambient for 2 hours minimum, 24 hours maximum after removal from the tests. and in case of the wetting tests, for example, moisture resistance tests, each component shall be made wipe or dry completely before the measurement. 19. failure criteria
23 ms6m 00765 h04-004-03a a 22 1. this product shall be used within its absolute maximum rating (voltage, current, and temperature). this product may be broken in case of using beyond the ratings. u?~???R?????~???????? ??? 2. connect adequate fuse or protector of circuit between three-phase line and this product to prevent the equipment from causing secondary destruction. ?]1??????]??u?gm?`???`` ???? 3. when studying the device at a normal turn-off action, make sure that working paths of the turn-off voltage and current are within the rbsoa specification. and ,when studying the device duty at a short-circuit current non-repetitive interruption, make sure that the paths are also within the avalanche proof(pav) specification which is calculated from the snubber inductance, the ipm inner inductance and the turn-off current. in case of use of igbt-ipm over these specifications, it might be possible to be broken. ?`???????H??`???R???E rbsoa ??? ?_J?R?j??????H???`?? ????`????? (pav) ???_J ????????? 4. use this product after realizing enough working on environment and considering of product's reliab ility life. this product may be broken before target life of the system in case of using beyond the product's reliability life. u??h????u?m????u?m? u?m????????????? 5. if the product had been used in the environment with acid, organic matter, and corrosive gas (for example : hydrogen sulfide, sulfurous acid gas), the product's performance and appearance can not be ensured easily. ?C?????????h????u?C?Q??^ ?? 6. use this product within the power cycle curve (technical rep.no. : mt6m04057). power cycle capability is classified to delta-tj mode which is stated as above and delta-tc mode. delta-tc mode is due to rise and down of case temperature (tc), and depends on cooling design of equipment which use this product. in application which has such frequent rise and down of tc, well consideration of product life time is necessary. u???``? ( gY no.: mt6m04057) ?`?? tj ??? tc ??? ?`? (tc) ?N???????u???H?O?? `???N?l????u????? warnings
23 ms6m 00765 h04-004-03a a 23 7. never add mechanical stress to deform the main or control terminal. the deformed terminal may cause poor contact problem. ???????????????? ? 8. if excessive static electricity is applied to the control terminals, the devices can be broken. implement some countermeasures against static electricity. ?^????????????Qr???? g? 1. fuji electric device technology is constantly making every endeavor to improve the product quality and reliability. however, semiconductor products may rarely happen to fail or malfunction. to prevent accidents causing injury or death, damage to property like by fire, and other social damage resulted from a failure or malfunction of the semiconductor products made by fuji electric device technology, take some measures to keep safety such as redundant design, spread-fire-preventive design, and malfunction-protective design. ??C???`?~u??|m??????u???k? `????C???`u?u???`Y?1???? ?b?p??p????LO????O??`?O????_? v 2. the application examples described in this specification only explain typical ones that used the fuji electric device technology products. this specification never ensure to enforce the industrial property and other rights, nor license the enforcement rights. ??d????C???`u?????h??? ??I??g??????g??SZ??? 3. the product described in this specification is not designed nor made for being applied to the equipment or systems used under life-threatening situations. when you consider applying the product of this specification to particular used, such as vehicle-mounted units, shipboard equipment, aerospace equipment, medical devices, atomic control systems and submarine relaying equipment or systems, please apply after confirmation of this product to be satisfied about system construction and required reliability. ??d?u?????r??C?????? ???O??u????????u??IC?C? @C??????????H?????| ?????_J? caution if there is any unclear matter in this specification, please contact fuji electric device technology co., ltd.

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